Executive Director, 3DIC Technical Solutions

Position: PnR Applications Engineer

Location: Seongnam-Si, Gyeonggi, Korea

We're looking for PnR Applications Engineer for High Performance Core to join our team

You Are: A seasoned professional with 1-2 years of hands-on design experience, particularly in backend physical design. You have a deep understanding of RTL2GDS design flow, CPU/GPU design, and low power design methodologies. Your expertise in advanced process nodes and solid scripting skills set you apart. You are a self-starter with good communication skills. You are comfortable connecting with senior personnel in your area of expertise, and your interpersonal skills make you a valued team member.

What You'll Be Doing:

• Work on frontend synthesis and backend physical design.
• Use PnR tool such as ICCII, Fusion Compiler or EDA tools.
• Leverage your understanding of advanced process nodes, physical design, and low power design methodologies.
• Utilize your scripting skills to automate processes.
• Collaborate with internal and external stakeholders.

The Impact You Will Have:

• Improve the efficiency of our design process.
• Contribute to the development of high-performance silicon chips and software content.
• Drive innovation in our product offerings.
• Enhance our team's skill set with your expertise.
• Foster strong relationships with stakeholders.
• Influence the future of technology at Synopsys.

What You'll Need:

• BS, background in EE and 1-2 years hands-on experience in similar role.
• Proficiency in backend physical design and optional for frontend synthesis
• Experience with PnR tools such as ICCII, Fusion Compiler, or EDA tools.
• Solid scripting skills, Knowledge of scripting languages such as Perl and TCL.
• Familiarity with IC Compiler I/II, Fusion Compiler or competitive EDA tools.
• Business level English.

Who You Are: You are self-motivated, with strong communication skill. You are a team player with good interpersonal skills.

Team You'll Work With:

The CSG Group is focused on solving the semiconductor design industry's high-value problems, including the march to angstroms, multi-die system integration, rapid node migration, right-first-time silicon, and reliability. Our full EDA software stack, spanning system architecture, design capture, verification, implementation, signoff, silicon lifecycle management (SLM), TCAD, and silicon manufacturing, enables our customers to rapidly bring high-performance chip designs to market. Our EDA stack is further augmented with hyperconvergence, AI engines, and data analytics that enable our customers to target their toughest productivity bottlenecks at every stage of chip design.