Field Process Engineer II

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POSITION TITLE: Field Process Engineer II

DIV/DEPARTMENT NAME: Semiconductor Equipment Division (SED)

REPORTS TO: Supervisor, Process Engineering

POSITION STATUS: Full-Time

WORK LOCATION: Scottsdale, AZ

WORK STYLE DESIGNATION: Hybrid (+50% Onsite)

WORK STYLE REQUIREMENT: Onsite - 80% / Remote - 20%

FLSA STATUS (E or N): Exempt

TRAVEL REQUIRED: Up to 50%

POSITIONS SUPERVISED: None

EXPECTED PAY RANGE: $79,169.05 - $108,857.44 Annually

The Pay range is for the position's base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process.

The Field Process Engineer II position is in Arizona and supports the business objectives of HTA's Semiconductor Equipment Division (SED) at the customer site. This position will require the engineer to be at the customer site approximately 80% of the time, supporting the customer as well as local service team. The main objective of this position is to provide process engineering support to SED's various customer activities and development programs associated with plasma etchers and Reactive Ion Etch (RIE) processes. The employee must be willing to travel to Asia for a training assignment if necessary. The engineer should be able to independently perform tasks, understand RIE theory, work in a cleanroom environment, and interface with customers on a detailed level. The engineer will effectively implement known solutions to routine process engineering problems.

• The position is expected to be able to lead assigned projects with management support and manageable risks; ensuring that necessary support is given to meet customer expectations and customer deadlines.

• Day-to-Day responsibilities include completing assigned tasks in a timely fashion, developing good customer relations, troubleshooting customer process issues, working closely with the customer to understand needs and reporting back to SED as well as managing and driving projects to closure.
• Perform hands-on RIE/dry etch process troubleshooting and development. This includes performing troubleshooting and data analysis at the customer site without the use of laptops or outside sources being carried into a high security fab, meeting the objectives of customer requirements for current customer projects, and updating recipes as needed.
• Perform etch process development to support productivity programs. This includes interacting with the customer to understand needs, making process DOE, achieving defectivity solutions and hitting customer process stability specs.
• Utilize analytical tools & techniques to solve process development issues.
• Analysis of data, design and execution of experiments including DOE at customer site.
• Upon completion of training, must be able to operate Hitachi plasma etch systems and all associated semiconductor metrology equipment.
• Working under supervision, must be able to complete process development tasks after receiving instructions.
• Generate internal and external documentation for products, presentations, and technical reports, and generate process engineering specifications.
• Interface with customers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues.
• May be required to support customer sites around the world as needed per SED business unit.
• Nights and weekends may occasionally be needed to support projects to closure.

• EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS

• BS Degree in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or related field.

• EXPERIENCE AND TRAVEL REQUIREMENTS

• 2+ years Plasma Etch Process experience or semiconductor processing preferred.
• Experience working with semiconductor equipment is highly desirable.
• Experience working in a cleanroom or Fab is highly desirable.
• May require travel to Asia for training or customer sites worldwide as needed.

• SKILLS AND ABILITIES REQUIREMENTS

• Advanced understanding and experience with dry etch/RIE and plasma science.
• Familiarity with a variety of metrology and characterization methods used in the semiconductor industry.
• Strong engineering analytical/problem solving skills. Understanding of Scientific Method and experience using it. In depth understanding of statistical process control (SPC) and design of experiments (DOE).
• Familiarity with working in a laboratory or fab and must be able to work in a clean room environment for extended hours.
• Ability to work overtime, shift work, and/or flexible schedule as needed.
• On time to work and training, on time completion of assignments, and strong preparation skills for assignments.
• Proactively protects IP/confidentiality and follows fab security measures.
• Ability to adapt to new procedures concerning work in the facility. Create and maintain technical and/or procedural documentation with our colleagues in Japan.
• Maintain appropriate records and documentation for all work performed.
• Self-motivated and show ability to adapt to changes in a fast-moving environment and stay until completion.
• Strong knowledge of chemistry, the ability to analyze OES data, equipment data, and utilize other predictive software is required.
• Must have good verbal and written communication and strong analytical capabilities.
• Demonstrate project planning, execution, and leadership skills with on-time delivery of milestones.
• Ability to work independently and in a team environment.
• Strong troubleshooting skills required.
• Must be able to work in a clean room environment for extended hours.
• Must have strong interpersonal skills as this role will be interfacing with engineers globally.

Equal Opportunity Employer (EOE)

If you require reasonable accommodation in completing this application, interviewing, completing any pre-employment testing, or otherwise participating in the employee selection process, please direct your inquiries to HTA-AccommodationRequests@hitachi-hightech.com